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Yield-Integration Engineering Manager - Expat role to Dalian, China


Santa Clara, CA
Job Code:
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Job Details

YieldCareers at Intel inIntegration Engineering Manager
Job ID: JR0049704
Job Category: Manufacturing
Primary Location: Santa Clara, CA US
Other Locations: Arizona, Phoenix; Oregon, Hillsboro; California, Folsom; Utah, Lehi;
Job Type: Experienced Hire

Yield-Integration Engineering Manager - Expat role to Dalian, China

Job Description

F68 Technology and Strategy Office TSO at Intel Dalian is forming a new engineering team with focus on manufacturing cost reduction through innovation, product enhancement, as well as developing and enabling equipment and process capabilities for future generations of 3D NAND technologies.

This job requisition is to seek for strong candidates for the positions of Integration Engineering Manager or Device Engineering Manager, reporting to Integration Solutions Area Manager in TSO.

The selected candidate will build and manage several strong teams, direct technology and resource planning activities, define and drive technology improvement and enablement roadmap, manage and coach engineers, and guide employee development, performance, and productivity issues.

This requisition has two openings.

Integration Engineering Manager will manage FEOL/BEOL Integration, YA, EFA, and Defect Reduction areas, while Device Engineering Manager will manage Device, Quality and Reliability, and inline and end of line test areas.

*The position requires up to 2 years of expatriate assignment in Dalian, China.


Candidate must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization, and must have direct people management experiences. Technical Qualifications -- BS, MS, or PhD in a science or engineering field and minimum 5 years of experience in research, development or manufacturing environment for the relevant technical areas are required--Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking--Hands-on experiences in technology development, technology transfer or startup are required--Strong expertise of process integration, device, and yield improvement is required --Direct experience in Silicon Process Technology Development is highly desired. Other Qualifications --Motivated self-starter, with strong ability to work independently as well as in a team environment --Strong verbal and written communication skills in English--Think and operate independently, while simultaneously focusing on many diverse priorities.--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities --Commit to aggressive goals and win with a can-do attitude--Act with velocity and a strong sense of urgency--Respect cultural diversity and sensitivity--Agility in learning, improving, and innovating.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Other Locations

Arizona, Phoenix; Oregon, Hillsboro; California, Folsom; Utah, Lehi;

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.


As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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