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Working Student (f/m) in package technology development

Intel


Location:
Munich, DE
Date:
08/18/2017
2017-08-182017-09-16
Job Code:
JR0031648
Categories:
  • Engineering
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Job Details

Working Student (f/m) in package technology development Careers at Intel in Munich,
   
Job ID: JR0031648
Job Category: Intern/Student
Primary Location: Munich, DE
Other Locations:
Job Type: Intern

Working Student (f/m) in package technology development

Job Description
  • Supporting our Package Technology Development Team in Munich in set up of test and reliability equipment to perform stress tests on newest package Technologies.
  • The working area is the reliability and stress test lab for the measurements and the office space for the data analysis.
  • Expected working period is from October 2017 to March 2017 with up to 20h / week.
  • Office and lab language is English


Qualifications

- Technical student of the following disciplines like technical engineering or physics/chemistry targeting a Bachelor or Master Degree
- Experience in MS Office Excel, MS-Project
- Good English skills are a must

Inside this Business Group

The Mobile and Communications Group delivers the next generation of smartphones, tablets, feature phones, and connected devices with leading-edge technologies. MCG is chartered with providing optimal hardware, software, and connectivity ingredients for mobile devices and complete system solutions that deliver compelling user experiences and delight both consumers and business professionals.

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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