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Undergraduate Logistics & Packaging Engineering Intern 2018


Phoenix, AZ
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Job Details

Undergraduate Logistics & Packaging Engineering Intern 2018 Careers at Intel in Phoenix, AZ
Job ID: JR0032844
Job Category: Intern/Student
Primary Location: Phoenix, AZ US
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Job Type:

Undergraduate Logistics & Packaging Engineering Intern 2018

Job Description
Responsibilities may be quite diverse of a nonexempt technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school.

If you are looking for a unique and interesting summer internship look no further. Intel’s Transport Materials and Media Engineering Group is looking for a motivated summer intern for 2018. The “Transport Materials and Media Engineering Group” (TMME) is a worldwide organization that delivers shipping media and packaging solutions for all Intel products and direct materials used in our manufacturing facilities and warehouse operations. TMME is responsible for the design, development, and qualification for the shipping media’s and packaging used to transport materials internally site to site and all finished products shipped to our customers. This includes wafers, bare die, finished microprocessors, solid state drives, board assemblies, and equipment related products to name a few. The successful candidate will be designing as well as conducting test experiments to gather baseline performance data on Intel shipping media and packaging to help understand design requirements and materials necessary to protect Intel products now and in the future. This will require working in a lab environment using packaging test equipment and metrologies such as packaged drop, vibration, unpackaged shock, accelerometer data acquisition, and data analysis using Excel and JMP statistical software. Individual may also be involved in adhoc testing as needed to support any and all media and packaging related requests for qualifications and or package testing to help understand the design and qualification process. Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Minimum Qualifications: Applicants must be enrolled in an accredited University either in or entering their senior year of studies and working toward a BS degree in Packaging, Mechanical, or Industrial Engineering. Applicants must have a legal right to work in the US without sponsorship. Preferred qualifications: Applicants should be hands on and not afraid to work in a Lab environment doing design of experiments on packaging and cushioning systems. Applicants should be able to demonstrate results in academic programs and projects related to the areas outlined below. Familiarity and or experience with Packaging Drop and Vibration, and Unpackaged Shock test methodologies. Key skill sets necessary to be successful include: Strong mechanical aptitude. Strong written and verbal communication skills. Working with Excel spreadsheets. Excellent planning, organization, presentation, and teamwork skills. Statistical data analysis – excel and JMP statistical software. Design of Experiments. Design Software - ArtiosCAD or similar CAD system, Solidworks or similar 3D Software.

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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