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Senior Virtual Prototyping Methodology Engineer

Intel


Location:
Bangalore
Date:
08/18/2017
2017-08-182017-09-16
Job Code:
JR0030282
Categories:
  • Engineering
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Job Details

Senior Virtual Prototyping Methodology Engineer Careers at Intel in Bangalore, KA
   
Job ID: JR0030282
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations: Germany, Duisburg; Germany, Munich;
Job Type: Experienced Hire

Senior Virtual Prototyping Methodology Engineer

Job Description

The Intel Communication and Devices Group is looking for a Senior Virtual Prototyping methodology engineer and an all-around Maker to play an integral role for facilitating VP based prototyping for complex wireless SoC platforms. We provide a highly sophisticated System Level Design and Prototyping flow that enables the development of leading edge wireless solutions. As part of the pre-silicon validation methodology and flow team you can directly influence the efficiency and quality of the wireless Platform chip + firmware + software development. This role will develop/create advanced Virtual Prototyping Methodologies and Flows to prototype hardware and firmware, our work is the enablement for providing outstanding products to our customers. Join us now as: Senior Virtual Prototyping methodology engineer f/m 5 good reasons to start at the Communication and Devices Group: -Exciting and challenging tasks -Extensive and systematic on-the-job training -Great opportunities for personal and professional development -Teamwork in an international environment -open communication and good working atmosphere You will develop leading System level design and Prototyping flows and improve methodologies. For that you will work companywide closely with your peers and project teams from other sites. Your major accountabilities: Virtual Prototyping Methodology and Flow development and project support -Development of Virtual Prototyping flow and methodology for wireless system projects -Provide common infrastructure tool integration, libraries, code generation, build system -Triage issues found in VP with design and verification-Providing transaction level modelling SystemC TLM libraries and IP -Enable Architectural explorations methodologies for performance and power, HW/SW partitioning and co-design -Improve re-use of architectural models including Mixed Signal and RF components -Support Virtual Prototyping development and Hybrid VP-RTL Emulation-Enable TLM - RTL co-simulation with common test bench approach


Qualifications

Required Skills -Extensive working/hands on knowledge of SystemC/ C++/ C -Experience with Virtual Prototyping and System Level Design Flows and Tools e.g. Synopsys Virtualizer, SIMICS, ARM Fast Model including usage of appropriate debugger e.g. Lauterbach-Architectural performance and power analysis e.g. Synopsys Platform Architect, Cofluent, Docea-Tools used in System Level Design, Software development and RTL implementation-Experienced programming/scripting skills eg. C, C++, Perl, TCL, Python Additional -Experience in performance analysis/debug techniques. -Solid IT know-how: OS,UNIX, Windows, version control -Strong analytical ability and problem solving skills, ability to quickly learn/adapt new technologies-Supportive attitude, excellent communication skills with global teams and EDA supplier-Knowledge of VHDL, Verilog, System-Verilog, micro-architecture development, Signal processing, filters, data-path designs, communication systems & standard and ASIC design flow RTL to GDS would be desirableQualificationsBS or Master's degree in Electronics/Electrical Engineering, with concentration on System and SW development7+ years of industry experience in digital design of complex SoC IP blocks and products. Extensive experience in Virtual Prototyping and RTL prototyping systems. Candidate should possess strong digital design and VLSI fundamentals.

Inside this Business Group

Intel is one of the largest suppliers of chips for the communications market. The Intel Communications group is focused on designing and building communications technologies such as Ethernet connectivity products, optical components, communications processing solutions and broadband products.



Other Locations

Germany, Duisburg; Germany, Munich;

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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