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Senior Thermal Engineer

Intel


Location:
Shanghai
Date:
01/15/2018
2018-01-152018-02-13
Job Code:
JR0050044
Categories:
  • Engineering
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Job Details

Senior Thermal Engineer Careers at Intel in Shanghai, Shanghai
   
Job ID: JR0050044
Job Category: Engineering
Primary Location: Shanghai, Shanghai CN
Other Locations:
Job Type: Experienced Hire

Senior Thermal Engineer

Job Description
In this position, you will be responsible for estimating, simulating and testing the thermal performance of Intel's server products and their corresponding thermal solutions including CPU heat sinks, Chipset heat sinks, VR Heat Sinks, IO Module Heat Spreaders and Memory thermal solution. In addition, you will be required to design, develop and validate new thermal capabilities and communicate power, thermal and mechanical product requirements for the server group. Your responsibilities will also include but not be limited to: - Estimating and simulating component thermal performance using Analytical methods, Computational Fluid Dynamics CFD and Finite* Element tools - Measuring and validating thermal estimates and simulations - Developing and automating new thermal measurement capabilities - Responsible for market analysis of Intel's competitive position on power, thermal performance and cost - Coordinating and communicating project status with internal program teams


Qualifications

You must possess a Bachelor of Science degree in Mechanical Engineering with five years of industry experience or a Master of Science degree in Mechanical Engineering with three years of industry experience. Additional qualifications include: - Strong design engineering skills with proficiency in Thermal tools Flotherm* or IcePak* - Solid experience with definition, testing and statistical evaluation of thermal and mechanical experiments - Good English communication skills - Proven ability to successfully manage multiple projects and schedules in a dynamic and fast paced environment - Highly motivated and results oriented - A self starter who requires minimum supervision to succeed - Knowledge of CAD tools AutoCAD* or Pro*\Engineer* would be an added advantage - Knowledge of IC Packaging, PC Architecture, Printed Circuit Boards PCB design, tolerance analysis, reliability testing and structural analysis would be an added advantage - Knowledge of manufacturing processes including Injection Molding, PCB fabrication, Extrusions, Sheet Metal and CNN would be an added advantage

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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