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Senior Engineer - LTE Physical Layer Firmware (f/m)

Intel


Location:
Nuremberg, DE
Date:
08/18/2017
2017-08-182017-09-16
Job Code:
JR0019251
Categories:
  • Engineering
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Job Details

Senior Engineer Careers at Intel in LTE Physical Layer Firmware (f/m)
   
Job ID: JR0019251
Job Category: Engineering
Primary Location: Nuremberg, DE
Other Locations:
Job Type: Experienced Hire

Senior Engineer - LTE Physical Layer Firmware (f/m)

Job Description

Intel is in the midst of an exciting transformation, reinventing the digital world every day. In everything we do, we are looking for those breakthrough product experiences. Join us and help us create the next generation of technologies that will shape the future for decades to come. Step inside our world and you will find one brilliant mind after another - current and future leaders - all working together in a spirit of collaboration that is simply contagious.

 We are looking for highly experienced bright engineers to join our LTE PHY Firmware Design & Development team at Nuremberg in Germany. You will be part of an experienced, international team of engineers that designs, implements and integrates new functionalities of the physical layer.

As an expert of LTE Physical Layer Firmware design/implementation, you will be responsibilities will include, but not limited to: 

  • Creating detailed design & architecture specifications
  • Implement LTE Physical Layer Firmware and support them through the full product life cycle.
  • Working closely with multi-functional HW, Firmware, System Engineering & Verification Teams across the world

What we offer you?

  • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.
  • Have a chance to participate in Intel Great Place to Work program which groups people who love running, cycling, squash, tennis, cross fit, photography, and many, many more exciting activities
  • Chill out with unlimited amount of coffee, tea, juices and soft drinks
  • Charge internal batteries during energetic team events

  • We offer a competitive salary and financial benefits such as bonuses, retirement plans, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).
  • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, flexible work hours, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work!


Qualifications

• Master's Degree or a PhD in related areas from a Tier1 Institute with multiple years of
relevant industry experience
• Experience in embedded architecture and Layer1 design or DSP firmware design/
development
• Hands-on C/C++ experience.
• Prior experience in Wireless Communication & LTE Physical Layer Algorithms
• In-depth understanding of the Physical Layer in 3GPP LTE covering Physical
layer features
• You are eager to contribute and work in highly qualified and motivated international team
• Proficient technical English language skills

Inside this Business Group

The Mobile and Communications Group delivers the next generation of smartphones, tablets, feature phones, and connected devices with leading-edge technologies. MCG is chartered with providing optimal hardware, software, and connectivity ingredients for mobile devices and complete system solutions that deliver compelling user experiences and delight both consumers and business professionals.

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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