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Product Development Engineer - Functional Yield and Binning

Intel


Location:
Penang
Date:
08/23/2017
2017-08-232017-09-21
Job Code:
JR0031558
Categories:
  • Engineering
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Job Details

Product Development Engineer Careers at Intel in Functional Yield and Binning
   
Job ID: JR0031558
Job Category: Engineering
Primary Location: Penang, PNG MY
Other Locations:
Job Type:

Product Development Engineer - Functional Yield and Binning

Job Description

• Develop binning and yield strategy to meet requirements of the newest FPGA products.  This includes defining bin-splits, developing models to improve yield/binning predictability, establishing targets/limits to control yield, and the development/bring-up of binning circuits.

• Drive for yield optimization through process improvements in product performance and power.  Engage worldwide teams on yield optimization across cross-functional areas such as manufacturing setup, test program, and wafer fabrication process targeting/tuning.

• Define and develop failure analysis / failure isolation (FA/FI) strategy for next generation FPGA products.  This includes:

o Examining product architecture and manufacturing setup to understand requirements.

o Automation/tools development for efficient & accelerated electrical failure analysis (EFA).

o Participation in DFT/DFX (design for test/manufacturing) definition to improve product manufacturability.

• Drive for functional yield improvement through collaboration with test/validation content developers and circuit designers to isolate and root cause silicon failures caused by manufacturing defect.



Qualifications
• BS/MS in Electrical/Electronic Engineering or equivalent, with >5 years of industry experience in semiconductors design or manufacturing. • Proven experience in post-silicon debug/troubleshooting, including hands-on experience with multiple ATE tester platforms and test vectors. • Well-versed with scan/ATPG, memory BIST, fault isolation models and test algorithms. Strong digital logic knowledge. • Expert understanding of binning methodology and yield enhancement processes/methods, across wafer and package level testing. • Possess ability to perform basic statistical and data analysis, including correlation study with tools such as JMP. Good working experience with SQL/Perl/TCL/Python are advantages.

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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