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Physical Structural Design Engineer

Intel


Location:
Bangalore
Date:
01/19/2018
2018-01-192018-02-17
Job Code:
JR0047909
Categories:
  • Engineering
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Job Details

Physical Structural Design Engineer Careers at Intel in Bangalore, KA
   
Job ID: JR0047909
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: Experienced Hire

Physical Structural Design Engineer

Job Description
Creates bottomsup elements of chip design including but not limited to FET, cell, and blocklevel custom layouts, FUBlevel floor plans, abstract view generation, RC extraction and schematictolayout verification and debug using phases of physical design development including parasitic extraction, static timing, wire load models, clock generation, customer polygon editing, autoplace and route algorithms, floor planning, fullchip assembly, packaging, and verification. Troubleshoots a wide variety up to and including difficult design issues and applied proactive intervention. Schedules, staffs, executes and verifies complex chips development and execution of project methodologies and/or flow developments. Requires expansive knowledge and practical application of methodologies and physical design.


Qualifications

Educational qualification with MS 6-8 years/ BS 8-12 years. Major in Electrical Engineering or Computer Engineering. Poses deep knowledge and working experience of industry standard flows to deliver RTL to Silicon physical Design/ Verification e.g. ICC, Primetime. Understanding of structural design techniques/ methodology flows related to synthesis, place & route, CTS, timing convergence, layouts, UPF power methodology, OASIS/GDS file usage is also needed. Automation skill and Proficiency in scripting languages such as Perl/Tcl. Expected to handle multi-tasking and flexibility while working with off site a global environment teams/ Strong communication skills and have self-motivation. Strong analytical & Problem solving skills.

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.


It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel’s offices for various positions and further requiring them to deposit money to be eligible for the interviews.   We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at and not fall prey to unscrupulous elements.


   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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