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Packaging R&D Engineer

Intel


Location:
Phoenix, AZ
Date:
09/20/2017
2017-09-202017-10-19
Job Code:
JR0000652
Categories:
  • Engineering
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Job Details

Packaging R&D Engineer Careers at Intel in Phoenix, AZ
   
Job ID: JR0000652
Job Category: Engineering
Primary Location: Phoenix, AZ US
Other Locations:
Job Type:

Packaging R&D Engineer

Job Description
Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.



Qualifications
Minimum qualifications: - The ideal candidate will have a MS or PhD in Organic Chemistry, Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Polymer Engineering, or other applied engineering degree. - Candidate must have 6+ months of work or educational experience in the following: o Developing new processes through hardware and software development as well as chemistry modification. o Strong understanding of chemical mechanisms in order to achieve tighter tolerances required for next generation packages. o Experience in troubleshooting integrated issues and working with a broad team of other process and integration engineers. o Experience in development/industrial tools in the IC, packaging or PCB industry. o Strong problem-solving, analytical and troubleshooting abilities o Good written and oral communication skills Preferred Qualifications: - Experience with electrodeposition, electroless deposition, electrochemistry, materials science, organic chemistry, organic composites and/or polymer chemistry/physics. - Prior experience in LYA, yield, Failure Analysis (FA), electrical test, or Quality & Reliability (Q&R) is a plus. - Detailed knowledge of some or all of the following is highly desirable: optical microscopy, electron microscopy (SEM, FIB, TEM, & EBSD), analytical techniques (FTIR, Raman, TGA, DSC), Surface analysis (XPS, TOF-SIMS), EDS, AFM, XRD, mechanical cross-sections, electrical test tools, electrical debug and analyses, and other package-level FA techniques - Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning


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