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NAND Product QRE

Intel


Location:
Shanghai
Date:
08/21/2017
2017-08-212017-09-19
Job Code:
JR0027937
Categories:
  • Engineering
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Job Details

NAND Product QRE Careers at Intel in Shanghai, Shanghai
   
Job ID: JR0027937
Job Category: Engineering
Primary Location: Shanghai, Shanghai CN
Other Locations:
Job Type: Experienced Hire

NAND Product QRE

Job Description

The candidate will join NSG Quality & Reliability team for product development engineering and manufacturing support of NSG's high performance, revolutionary NAND, which will be in product transfer mode or in HVM at FAB or OSAT in Asia Region. The primary responsibility is to co-work with US partner to perform qualification activities for new FAB/OSAT factory startup meanwhile identify and resolve NAND related failures from component factory and/or SSD Solid-State-Drive factory to improve product yield, quality and/or reliability. The person will identify fail modes, complete electrical FA on components to understand the root cause and provide containment and fixes. He/she will use appropriate tools such as bench testers, oscilloscope, logic analyzer and other test systems to do component level failure analysis and debug. The person will closely work with NSG team and other partners e.g. Product Engineering, Test Engineering, FAB/OSAT, SSD Engineering, etc. to ensure adequate quality/reliability of Intel-branded NAND and SSD modules. Performs other related duties as required or as directed.


Qualifications

You must possess a Bachelor of Science degree or a Master of Science degree preferably in Electrical Engineering, Physics, Materials Science or an applicable technical degree. Additional qualifications include: - 5+ years working experience in IC industry with strong Quality & Reliability knowledge of component manufacturing, good at test methodologies, failure analysis & DPM measurement - Flash memory experience, including module, product & package level, plus Flash Component manufacturing flow FAB, Sort, Assembly, Test would be an added advantage. - Good problem solving experience, and Electrical/Mechanical FA or board/package level physical FA experience will be preferred. - Excellent teamwork/leadership skills and the ability to work well with both internal/external teams from US and Asia. - Self-motivated with strong interpersonal, written and oral communication skills - Regular travel which may include extended stay in the US or Asia.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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