Sign In
 [New User? Sign Up]
Mobile Version

Module Engineering Manager


Job Code:
  • Engineering
  • Save Ad
  • Email Friend
  • Print

Job Details

Module Engineering Manager Careers at Intel in Dalian, Liaoning
Job ID: JR0036178
Job Category: Manufacturing
Primary Location: Dalian, Liaoning CN
Other Locations:
Job Type: Experienced Hire

Module Engineering Manager

Job Description

F68 Technology and Strategy Office TSO at Intel Dalian is forming a new engineering team with focus on manufacturing cost reduction through innovation, product enhancement, as well as developing and enabling equipment and process capabilities for future generations of 3D NAND technologies. This job requisition is to seek for strong candidates for the positions of Module Engineering Manager, reporting to Process Solutions Area Manager in TSO. The selected candidates will build and manage several strong teams of process and equipment engineers, and direct all process, hardware, materials, and operational activities within their areas, manage and coach engineers, and guide employee development, performance, and productivity issues.This requisition has two openings. Thin Film Module Engineering Manager will manage CVD/PVD/CMP/Diffusion/Implant/Metro areas, and Patterning Module Engineering Manager will manage Lithography/Wet Etch/Dry Etch areas.An expatriate assignment of up to 2 years might be required for qualified internal candidates.


Candidate must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization, and must have direct people management experiences. Technical Qualifications -- BS, MS, or PhD in a science or engineering field and minimum 5 years of experience in research, development or manufacturing environment for the relevant module areas are required--Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking--Hands-on experiences in technology development, technology transfer or startup are required--Strong expertise of process integration, device, and yield improvement is required --Direct experience in Silicon Process Technology Development is highly desired. Other Qualifications --Motivated self-starter, with strong ability to work independently as well as in a team environment --Strong verbal and written communication skills in English--Think and operate independently, while simultaneously focusing on many diverse priorities.--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities --Commit to aggressive goals and win with a can-do attitude--Act with velocity and a strong sense of urgency--Respect cultural diversity and sensitivity--Agility in learning, improving, and innovating

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.


As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

Powered ByLogo

Featured Employers

Featured Jobs