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IC Packaging Technical Leader

Intel


Location:
Santa Clara, CA
Date:
01/19/2018
2018-01-192018-02-17
Job Code:
JR0050737
Categories:
  • Engineering
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Job Details

IC Packaging Technical Leader Careers at Intel in Santa Clara, CA
   
Job ID: JR0050737
Job Category: Engineering
Primary Location: Santa Clara, CA US
Other Locations:
Job Type: Experienced Hire

IC Packaging Technical Leader

Job Description

As a Senior Silicon Photonic Packaging Technical Leader, you'll be part of Intel's Silicon Photonics team that is leading the 100G-market transition and driving innovation for next generation of optical interconnect products. You will play a critical role in the next generation silicon photonics wafer and chip level packaging and assembly designs. Specific job responsibilities include:Provide IC and photonics packaging technology leadership to the team. Take Silicon Photonics wafer & chip level packaging and assembly product from concept to HVM release through an OSAT partner. Advanced packaging technology and assembly process architecture for FCBGA, FCMCM, fcCSP, Stacked-die CSP packages, Work with cross-functional teams to select the optimized package solution. Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages. Design redistribution layers and work with design team to optimize die floorplan & bump patterns. Packaging assembly metrology tools, Failure/Root cause analysis and feedback to OSAT assembly process, SPC metrics to achieve high end to end assembly yield.  Drive DFx for IC packaging design and assembly. Drive stress and temperature modeling to validate packaging and process architectureCollaborative reviews with key stakeholders and executive sponsors. Oversee and lead the package development effort from concept through initial production ramp. Partner with Module HW, Mechanical, Photonics, IC, SW/FWTest, Operations and Reliability teams


Qualifications

Minimum Qualifications

BS/MS/PhD in Electrical/Mechanical/Materials Engineering or related discipline.

Experience: 6+ years in IC packaging and assembly required

Hands-on expertise of assembly processes for flipchip, wirebond, & wafer level packages

Expertise in Cadence APD, Define constraint file based on package design rules

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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