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High Speed PHY and DSP student

Intel


Location:
Haifa, IL
Date:
08/21/2017
2017-08-212017-09-19
Job Code:
JR0029676
Categories:
  • Engineering
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Job Details

High Speed PHY and DSP student Careers at Intel in Haifa,
   
Job ID: JR0029676
Job Category: Intern/Student
Primary Location: Haifa, IL
Other Locations:
Job Type: Intern

High Speed PHY and DSP student

Job Description
Our team develops wide range of state of the art solutions for next generation processors and ultra-high speed network chips, with Intel's most advanced development process. We focus on the high-speed communication physical layer design PHY Design. The team is responsible for the development and integration of PHY solutions for different segments as PCI-Express, Ethernet, USB, Thunderbolt and more. The tools in which the student will perform the development and analysis are mainly Matlab and Simulink.


Qualifications

MSc and PhD student in EE or other relevant fieldKnowledge or experience in digital signal processing and communication - advantageAvailability for at least 3 working days per week

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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