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Hardware Interface - Tooling Engineer


Folsom, CA
Job Code:
  • Engineering
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Job Details

Hardware Interface Careers at Intel in Tooling Engineer
Job ID: JR0050116
Job Category: Engineering
Primary Location: Folsom, CA US
Other Locations:
Job Type: Experienced Hire

Hardware Interface - Tooling Engineer

Job Description

Intel is looking for a new Hardware Interface Tooling Engineer to join our team within the Non-Volatile Memory Solutions Group.  This role will be a valued member of NSG's test floor equipment planning and technical review boards. Success is measured by just-in-time initial test capability, driving tooling cost improvements, ensuring appropriate and/or increasing test capacity, customer and peer feedback, and product teams support through the use of sustainable technology solutions and effective leadership.

Job responsibilities include (but are not limited to):

  • Conducts or participates in multidisciplinary research in the design, development, testing and utilization of information processing hardware and/or electrical components, mechanisms, materials, and/or circuitry, processes, and packaging for NAND units, SSDs and/or peripheral equipment.
  • Prepares specifications, evaluates vendors, and analyzes test reports.
  • Ensures products conform to standards and specifications.
  • Develops plans and cost estimates and assesses projects to analyze risk.
  • Develops procedures, analysis and design for computer components, products, and systems.
  • Initiates, guides, and coordinates overall design and development of new ideas and products.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and judgement.


Required Skills/Experience:

  • A minimum of 2 yrs experience working in the semiconductor field in hardware tooling development in combination of a BS Degree, OR 0+ years of experience in combination with a Master’s Degree, OR 5+ years of related experience will be considered in lieu of a Degree

Preferred Skills/Experience

  • B.S. in Electrical or Mechanical
  • Prior experience with wafer micro-probe and TEL, NAND class test, SSD, and/or SiP electro mechanical interface hardware tooling
  • Prior experience in providing leadership in technical direction through project planning and internal customer support in a cross site, multi-disciplined engineering environment, and work within a framework of coordinated activity with external commercial supplier's senior engineers, project managers, logistics, and sales reps.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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