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FE CAD Intern


Haifa, IL
Job Code:
  • Engineering
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Job Details

FE CAD Intern Careers at Intel in Haifa,
Job ID: JR0047026
Job Category: Intern/Student
Primary Location: Haifa, IL
Other Locations:
Job Type: Intern

FE CAD Intern

Job Description
A candidate for a temporary position who has not yet graduated and is working towards a relevant Bachelor's, Specialist's, Technical, Master's or PhD degree from a relevant academic institute. A Student employee can do specific work in the area of their future degree or work as a Generalist in a specific department. The Studentship is limited in time with the intent to hire into an College Graduate/Technical Graduate position as appropriate.


In this position you will be developing, testing, and deploying state-of-the-art Tools, Flows, and Methodologies TFM's. These TFM's are used for RTL Design and Validation efforts across the vast majority of our SoC and IP development organizations. You will also be responsible for development, training, documentation, and providing support to customers from various Intel design teams across the world. As a student in PDS, you will work as part of a multidisciplinary team to develop software tools that meet Intel's specific, rapidly evolving requirements for designing, testing, and packaging silicon products. We work very closely with Intel's chip designers to understand their technical challenges and accordingly create proprietary CAD solutions. - Current enrollment in a Bachelor's, Master's, or PhD program in Computer Science, Software Engineering, Computer Engineering, Electrical Engineering or Information Systems.- At least four semesters remaining for graduation.- The job requires 20 work hours per week on average. Working hours/days are flexible. It is possible to work less hours during the exams period and more hours during off-studies vacations.- Knowledge of at least one programming language and/or UNIX scripting.- Self-motivated and independent team player with excellent communication skills.

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.


As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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