Sign In
 [New User? Sign Up]
Mobile Version

Failure Analysis R&D Engineer

Intel


Location:
Phoenix, AZ
Date:
08/21/2017
2017-08-212017-09-19
Job Code:
JR0027095
Categories:
  • Engineering
  •  
  • Save Ad
  • Email Friend
  • Print
  • Research Salary

Job Details

Failure Analysis R&D Engineer Careers at Intel in Phoenix, AZ
   
Job ID: JR0027095
Job Category: Engineering
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: College Grad

Failure Analysis R&D Engineer

Job Description

Responsible for identifying component failures and researching process/materials improvements to enhance yield, performance, quality and reliability of next generation Product and Package technologies. Conduct hands on lab work, define failure analysis strategy, evaluate the electrical and thermal mechanical characteristics of integrated circuits to determine the root cause of failures and recommend corrective actions working with cross functional teams. Owns the development of innovative fault isolation and failure analysis methods to accelerate failure identification and mechanism understanding on future technologies and products. Drives technology transfer to high volume manufacturing and owns proliferation of shared learning across sites. Maintains necessary records and reports. Performs other related duties as required or as directed.

The ideal candidate will exhibit the following behavioral traits:

  • Good communication and decision making skills.
  • Strong teamwork and planning/time management skills.
  • Able to deliver under pressure in a fast paced environment.
  • Ability to work well in ambiguous situations.
  • Mature, self-assured, well organized and attention to detail.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:
The candidate must possess a PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, Solid-State Physics or any other related field of study.

Preferred Qualifications:

• Strong academic background in one or more areas of polymer materials, mechanical behavior of materials, and semiconductor processing and device physics.
• Knowledge and hands on experience in Electrical Fault Isolation, advanced imaging techniques, nondestructive and destructive failure analysis methods, material analysis and characterization methods.
• Familiarity with packaging materials and assembly process, design of experiments and ability to understand complex failure mechanisms and identify root causes of failures working with cross functional teams.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

Powered By

Featured Employers

Featured Jobs