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Bluetooth System Firmware Engineer

Intel


Location:
Bangalore
Date:
01/17/2018
2018-01-172018-02-15
Job Code:
JR0048684
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Job Details

Bluetooth System Firmware Engineer Careers at Intel in Bangalore, KA
   
Job ID: JR0048684
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: Experienced Hire

Bluetooth System Firmware Engineer

Job Description
About us:Intel's Wireless Connectivity Solutions's vision is that EVERYONE and EVERYTHING will best CONNECT with Intel Connectivity. We are working on delivering world-class wireless connectivity technologies such as Wi-Fi, global navigation satellite system GNSS and location, Bluetooth, and Wireless Gigabit WiGig. One of the AMAZING groups is the Bluetooth Core products BCP. This group develops and ships cutting edge Bluetooth solutions, from prototyping to full product. Products developed by Intel BCP are designed to be integrated in various market segment.The Bluetooth System team is looking for a new talented Firmware System engineerAbout you:As a Bluetooth FW System engineer your job role will consist of: Develop Bluetooth Firmware architectures/features Write FW System Architecture specification and derive requirements Source code development of some of the feature Work closely with System lead, HW system engineer, development and validation team to complete features


Qualifications

Energetic, self-driven, self-disciplined, creative, and GTD Getting Things Done Excellent communication skills Fluency in C and in one or more high-level programming languages Python, Perl, Tcl/Tk, etc. Good technical problem solving skills A bachelor's degree or higher in an Engineering discipline More than 8 years of Hands-on experience in one or more of the following areas: Embedded Systems Digital Signal Processing DSP Digital CommunicationGood understanding in Wireless System architecture Bluetooth and WiFi experience preferred

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.


It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel’s offices for various positions and further requiring them to deposit money to be eligible for the interviews.   We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at and not fall prey to unscrupulous elements.


   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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