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3G Firmware Senior Engineer

Intel


Location:
Bangalore
Date:
08/18/2017
2017-08-182017-09-16
Job Code:
JR0022124
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Job Details

3G Firmware Senior Engineer Careers at Intel in Bangalore, KA
   
Job ID: JR0022124
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: Experienced Hire

3G Firmware Senior Engineer

Job Description
As an expert of software design and 3G WCDMA physical layer, you will be responsible to manage the interface with the Customers, R&D Firmware Teams, architecture teams and drive the commercialization process. Your responsible for working closely with Project Management Teams. You will work closely with our Firmware, System Engineering & HW teams across the world and also with the InHouse Verification/Field Test/IOT Teams and Test houses


Qualifications

We are looking to strengthen our 3G WCDMA Physical Layer management team in Bangalore and are seeking talented candidates to work on driving Customer Projects for Intel's 3G WCDMA Physical Layer. You're an ideal candidate if you bring the following experience: General ---------- You should have a relevant domain experience of 5 to 10 years. You have managerial experience dealing with Customers internal and external. You are eager to contribute and work in highly qualified and highly motivated team working across multiple sites in the world. You are working in a structured, solution oriented and open minded working mode You have very good communication skills in English.You own a Bachelor's/Master's Degree or a PhD in related areas from a Tier1 Institute You have a solid understanding of software development & methodologies You have the ability to understand complex technical systemsDomain specific Skills: 3G Physical Layer------------------------------------------------Strong software Development & debugging skills for embedded devices and computer science in general areas Very deep understanding of the Physical Layer in 3GPP covering o UMTS/3G/WCDMA/HSDPA/HSUPA /HSPA+ system o Understanding of the RRC and MAC procedures and their interfaces towards the PHY o Inter RAT IRAT o Layer1 Control design or DSP firmware design/development o Power consumption for PHY operation o Working knowledge of signal processing concepts for 3G PHY o Knowledge of component LTE PHY and system level verification aspects including IOT, GCF etc.Experience in ARM low level embedded software programming including HW configuration, state machine design with timing constraints.Experience in FW design including external and internal FW interfaces for functional as well as timing aspects .3G Protocol Stack Layer1, Layer2-RLC/MAC, Layer3-RRC experience would be a plus.Excellent system Debugging skills from device traces.

Inside this Business Group

Intel is one of the largest suppliers of chips for the communications market. The Intel Communications group is focused on designing and building communications technologies such as Ethernet connectivity products, optical components, communications processing solutions and broadband products.

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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