Sign In
 [New User? Sign Up]
Mobile Version

3G Firmware Senior Engineer

Intel


Location:
Bangalore
Date:
09/22/2017
2017-09-222017-10-21
Job Code:
JR0036611
  •  
  • Save Ad
  • Email Friend
  • Print

Job Details

3G Firmware Senior Engineer Careers at Intel in Bangalore, KA
   
Job ID: JR0036611
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: Experienced Hire

3G Firmware Senior Engineer

Job Description
5-15 years of experience Bachelors/Masters degree in Communications/Electronics/Computer Science Good knowledge in Wireless Communications Fundamentals Excellent Programming, Design & Coding Skills in C using complex data structure Firmware design & implementation of UMTS/3G/WCDMA/HSDPA/HSUPA /HSPA+ systems Proven experience in implementing Firmware for 3GPP Standards, SW/FW design for embedded real-time systems Experience in ARM low level embedded software programming including HW configuration, state machine design with timing constraints Experience in FW design including external and internal FW interfaces for functional as well as timing aspects 3G Protocol Stack Layer1, Layer2 RLC/MAC, Layer3RRC experience would be a plus Excellent system Debugging skills from device traces Keyword: Firmware, Layer1, 3GPP, Wireless, UMTS, 3G, WCDMA, HSDPA, HSUPA, HSPA, C, 3G Protocol Stack RRC/RLC/MAC, RTOS, Embedded


Qualifications

5-15 years of experience Bachelors/Masters degree in Communications/Electronics/Computer Science Good knowledge in Wireless Communications Fundamentals Excellent Programming, Design & Coding Skills in C using complex data structure Firmware design & implementation of UMTS/3G/WCDMA/HSDPA/HSUPA /HSPA+ systems Proven experience in implementing Firmware for 3GPP Standards, SW/FW design for embedded real-time systems Experience in ARM low level embedded software programming including HW configuration, state machine design with timing constraints Experience in FW design including external and internal FW interfaces for functional as well as timing aspects 3G Protocol Stack Layer1, Layer2 RLC/MAC, Layer3RRC experience would be a plus Excellent system Debugging skills from device traces Keyword: Firmware, Layer1, 3GPP, Wireless, UMTS, 3G, WCDMA, HSDPA, HSUPA, HSPA, C, 3G Protocol Stack RRC/RLC/MAC, RTOS, Embedded

Inside this Business Group

Communication & Devices Group: The wireless revolution at Intel! We are one team - passionate engineers and technologists from diverse industry backgrounds working together to realize a world of connected computing. We are bringing the best ideas from the brightest minds to deliver future mobile experiences into the market. We are on the journey towards making Intel a wireless leader with exciting products for the Internet of Things, 5G and an opportunity to change the world with your work.

   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

Powered By

Featured Employers

Featured Jobs