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3D XPoint Product Development Engineer

Intel


Location:
Boise, ID
Date:
01/17/2018
2018-01-172018-02-15
Job Code:
JR0046639
Categories:
  • Engineering
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Job Details

3D XPoint Product Development Engineer Careers at Intel in Boise, ID
   
Job ID: JR0046639
Job Category: Engineering
Primary Location: Boise, ID US
Other Locations:
Job Type: Experienced Hire

3D XPoint Product Development Engineer

Job Description

Intel is looking for a 3D XPoint Product Development Engineer that will be responsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. This role makes significant contributions to design, development and validation of testability circuits.

Additional Responsibilities Include (but are not limited to)

  • Complete evaluation, development and debug of complex test methods.
  • Develop and debug complex software programs to convert design validation vectors and drive complex test equipment.
  • Create and test validation and production test hardware solutions.
  • Test, validate, modify, and redesign circuits to guarantee component margin to specification.
  • Analyze and evaluate component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.
  • Analyze early customer returns with emphasis on driving test hole closure activities.
  • Create and apply concepts for optimizing component production relative to both quality and cost constraints.


Qualifications

Required Skills/Experience

  • BS, MS or PhD in Electrical Engineering, Computer Science or Computer Engineering
  • +3 years experience working with non-volatile memory component technology example: Next Gen NVM memory/NAND/NOR/DRAM AND/OR CPU technology as a Product Engineer, Product QRE, Test Engineer, Design Engineer, or other similar job function.

Preferred Experience/Skills:

  • Prior experience working with oscilloscopes
  • Prior experience with micro-probing
  • Scripting experience in EITHER Python OR Perl.
  • Knowledge of silicon physical failure analysis PFA methods
  • Working knowledge of semiconductor manufacturing processes and silicon process development
  • Prior experience with analog or mixed signal circuit design or validation.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
   

As an electronics industry innovator and a leader in corporate responsibility, we look for ways to apply our technology to address global challenges while serving as a role model for how companies should operate.

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