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3D-XPoint Mixed Signal Design Engineer

Intel


Location:
Folsom, CA
Date:
01/22/2018
2018-01-222018-02-20
Job Code:
JR0048662
Categories:
  • Engineering
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Job Details

3DCareers at Intel inXPoint Mixed Signal Design Engineer
   
Job ID: JR0048662
Job Category: Engineering
Primary Location: Folsom, CA US
Other Locations:
Job Type: Experienced Hire

3D-XPoint Mixed Signal Design Engineer

Job Description

An analog designer on the 3DXP design team will be responsible for pathfinding new solutions to reduce energy, power, latency, die size of 3DXP products and to develop solutions for new technology requirements. An analog designer may be responsible for post silicon device characterization and debug. Once all paths have been identified, designers build and test schematics that meet all functionality and performance goals for the designated 3DXP products and develop methodologies and coverage metrics to ensure quality at the fullchip level. After design is complete, designers support fullchip validation by building various path and fullchip models and running extensive full chip validation suites while also working with layout to ensure cell level and block level layout is being drawn as necessary to achieve the desired performance and spec functionality. Finally, the designers work with product engineering to debug post silicon issues by developing models for observed behavior and proposing experiments both in silicon and in simulation to prove or disprove the proposed models.


Qualifications

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.


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